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 Process Capabilities

Quasi-3D structures: Stacked with metal or insulation layers structures with same or different materials.

General design rules :

 Substrate dimension: 6” square

 General line/spacing : 10 microns/10 microns

 R-angle diameter > 3 microns

 Single layer structure:

  • Thickness: 10 microns to 100 microns
  • Aspect Ratio up to 4:1 (dependant to critical dimensions)
  • Surface TTV: < 2 microns 
  • Side wall angle < 3 degree
               
 

 

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