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  • Facilities and Equipment

 Facilities and Equipment

WinMEMS has built up a complete in-house LIGA-like process production line. We own a class-100 clean room facility over 300 square meters, consisting of lithography, electro-plating and post-process area:

Lithography area: Photo resist coaters, Lithography tools, Developers, baking ovens, plasma etch.

Electro-forming bathes (Ni-based alloy, Cu), SIP testing equipment (flatness, roughness …), shear
    tester

Post-process area: Post-process area: Planarization equipment, TTV and surface roughness
    measurements.

 
Equipment Capabilities
 Lithography Equipment
  • Max Process Area: 150mm x 150 mm or 300mm x 300 mm
  • Layer-to-layer Alignment Accuracy: 2 microns

 Electro-forming Equipment

  • Max Process Area: 150mm x 150 mm or 300mm x 300 mm
  • Materials:  Ni-based alloys, copper...
 Planarization Equipment
  • Total Thickness Variation (TTV): < 2 microns
  • Thickness tolerance control: < 2 microns
  • Roughness: < 5 nm 
 
Lithography Area Electro-forming Area
   
 
 

 

No.200-5, Shanying Rd., Guishan Dist., Taoyuan City , Taiwan 33341
TEL: 886-3-359-5868 
Copyright © 2011 WinMEMS Technologies All Rights Reserved.