Lithography area: Photo resist coaters, Lithography tools, Developers, baking ovens, plasma etch.

Electro-forming bathes (Ni-based alloy, Cu), SIP testing equipment (flatness, roughness …), shear
    tester

Post-process area: Post-process area: Planarization equipment, TTV and surface roughness
    measurements.

 Lithography Equipment

• Max Process Area: 150mm x 150 mm or 300mm x 300 mm
• Layer-to-layer Alignment Accuracy: 2 microns

 Electro-forming Equipment

• Max Process Area: 150mm x 150 mm or 300mm x 300 mm
• Materials:  Ni-based alloys, copper...

 Planarization Equipment

• Total Thickness Variation (TTV): < 2 microns
• Thickness tolerance control: < 2 microns
Roughness: < 5 nm